Printed Circuit Board MEMS

The impact of electronics and computing on the operation and daily life of society has been enormous. A second revolution, microelectromechanical systems (MEMS) is occurring that combines electrical and mechanical capabilities on the same electronic device real estate. MEMS are ushering in a sensor rich era and will take its place alongside microcomputing as a necessary technology in an information rich and secure society. MEMS devices demonstrated to date have been sensors, sensors and actuators and integrated devices that include signal conditioning, control and telemetric circuitry. Every MEMS device however still needs to be packaged or is contained by at least one printed circuit board (PCB) and built into larger systems.

There is a third movement emerging: PCBMEMS. This field is the next stage of evolution of the printed wiring board beyond simply providing electrical interconnection and mechanical support. PCBMEMS is the combined insertion of mechanical, fluidic, optical and electronic components to be integrated into the PCB landscape and permits a complete system “on a board”. PCBMEMS uses PCB fabrication technologies to create integrated micromechanical, fluidic, optical and electronic systems and is a systems technology revolution. USF has been developing integrated microsystems for field applications using PCBMEMS. The systems are based on newly available printed circuit materials with the various sensing elements made within the board material itself and in combination with microchips. The systems that utilize this technology approach are directed toward chemical, biological and physical sensing devices but will have applications in consumer, computer, telecom, medical, aerospace, automotive and environmental sectors.

• Area (1): LCP/Cu is an emerging and suitable basis for PCBMEMS and is currently being demonstrated. More work focused on added embodiments of LCP PCBMEMS. Other polymeric, composite and nonlinear, nano and microtechnology materials are being explored.
• Area (2): Emerging new processes in deposition, etching and lamination.
• Area (3): PCBMEMS systems design and development will occur and will be directed to applications.
• Area (4) Education and Training should occur to expose and accelerate the new discipline.